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E-Week 2016 | High-Performance RF Material

Presented by: Ed Sandor (Taconic) and Lee Klaus (Cain-Forlaw)

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This presentation will provide an overview of printed circuit board material systems, covering the differences in electrical (dielectric constant, dissipation factor) and mechanical (moisture absorption, glass transition temperature, Z axis CTE, etc.) properties of various material systems. It will also focus on the best materials for high power amplifiers typically used in broadcast equipment. Part of the GatesAir Connect Lunch and Learn series. Presented by Ed Sandor, Applications Engineering Manager of Taconic, and Lee Klaus, Sales Engineer for Cain-Forlaw

Ed Sandor

Ed Sandor has a degree in Electrical Engineering from Bucknell University in PA and a BS in Accounting from the U of Minnesota. He has been involved with microwave materials as an Applications Engineer since 1984 helping designers with material selection, working with the PCBoard shops on manufacturing and tracking projects through inception to final assembly. He has been with Taconic as Applications Engineering Manager since 2003. He is Chairman of the IPC D-20 committees which cover numerous committees for design guides and standards on microwave and high speed digital boards, Printed Circuit Board manufacturing standards and Microwave and high speed digital materials specifications including numerous committees on material testing and PC board performance testing. He is also on the IPC Technical Advisory Executive Committee which oversees present and future IPC technical activities.

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